Sunday, March 30, 2014

DEPOSITION ACRONYM DEFINITIONS

The various deposition acronyms don't really have solid definitions. For example, depending on who you ask you may get different answers as to what the acronym PVD (physical vapour deposition) means and / or the process it refers to. In Episode 3 of Coaters Tech videos I talked about what these definitions mean and defined them.

The following is a list of those acronyms and their definitions:
  • PVD - physical vapour deposition - The process by which a material is vapourized and deposited where the source material and the deposited material are the same in their chemical makeup. In this process there may be dissociation of compounds at the source but upon deposition the dissociated elements recombine to become the same compound as the source material (eg. MgF2, Au).
  • CVD - chemical vapour deposition - The process by which a material is vapourized and deposited where the source material (either through intent or dissociation) and the deposited material are different in their chemical makeup. In this process the source material or the vapourized components of the source material require process gasses to achieve the desired deposited compound (eg. Ti2O3 > TixOy vapour + O2 = TiO2, HfO2 > HfxOy vapour + O2 = HfO2).
  • PECVD - plasma enhanced chemical vapour deposition - The process by which a deposited materials' physical properties are manipulated during deposition with the bombardment of plasma (accelerated charged particles) (eg. deposited material density).
  • PACVD - plasma activated chemical vapour deposition - The process by which a material is vapourized and deposited where the source material and the deposited material are different in their chemical makeup. In this process the vapourized source material requires charged process gasses to interact with chemically in order to achieve the desired deposited compound (eg. Ti + N+ = TiN). The ionized process gas is required to achieve the desired deposited compound.
PECVD - magnetron sputtering with an ion gun
More acronyms for thin film deposition whose definitions are specifically implied and fall under the 4 definitions listed above are:
  • ALD - atomic layer deposition
  • MOCVD - metal organic chemical vapour deposition
  • MBE - molecular beam epitaxy
  • PLD - pulsed laser deposition
  • ...and many more.
What do you think? How do you define the various deposition acronyms?
What are some other deposition technique acronyms?

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